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Nationwide Electronics Inc. Tech Tip of The Week |
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| June
New Product Showcase: Upgrade Your Work Station for BGA Rework As any technician familiar with BGA lips will confirm, these components are one of the most difficult' items to replace on a PCB. Many desoldering units on the market cannot handle the challenge of safely removing BGAs. The amount of heat required to simultaneously melt the solder on all the BGA pins could easily result in damage to the PCB or to other components on the PCB. Hozan has met the challenge of BGA removal by developing a new series of nozzles for the HS-603 Spot Heater. The HS-603 provides a stream of hot air, with both the air temperature and volume controllable from front panel settings on the station. This very portable compact instrument has served the electronics industry for a decade in production rework stations, service enters, and electronic repair shops for removal of SOP, QFP, SOJ, LCC, PLCC, and MSP components from PCBs. The standard HS-603 nozzles are designed to focus the hot air directly on the chip leads, minimizing exposure of the surrounding circuitry and the PCB to heat damage. The lightweight HS-603 hand piece is easy to operate. The nozzle tip should not actually touch the tip of any part of the PCB, thereby eliminating any potential damage from electrical discharge from the HS- 603 or the technician. Hozan has developed a wide array of standard nozzles so that nearly every common dip size is accommodated. With the growing demand for means of servicing BGA (CSP) applications, Hozan designed the HS-651 through H5-457 series of nozzles. A primary observe in PCB repair/rework is to minimize the time the PCB is exposed to high temperature. Since more heat is required to remove BGA components than for the majority of other chips, this new series of nozzles includes strategically placed holes in the nozzle base, in addition to the pipes which direct hot air onto the chip leads, providing additional heating of the BGA chip, thereby minimizing chip removal time. The addition of the BGA nozzle series to the HS-603 Spot Heater nozzle inventory, provides a rather inexpensive and effective means of adding BGA servicing capability to those work stations which have an HS-603 Spot Heater. And for your work stations that don't already have an HS-603, upgrade with an HS-603 and nozzles for BGA rework! |